ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,987, issued on Aug. 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Ming-Ho Tsai (Hsinchu, Taiwan), Jyun-Hong Chen (Taichung, Taiwan), Chun-Chen Liu (Kaohsiung, Taiwan), Yu-Nu Hsu (Tainan, Taiwan), Peng-Ren Chen (Hsinchu, Taiwan), Wen-Hao Cheng (Hsinchu, Taiwan) and Chi-Ming Tsai (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including: a first formation site and a second formation site for forming a first conductive bump and a second conductive bump; when a first environmental density corresponding to the first formation site is grea...