US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor package structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,137, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package structure and method for manufacturing the same" was invented by Yang-Che Chen (Hsin-Chu City, Taiwan), Chen-Hua Lin (Yunlin County, Taiwan), Huang-Wen Tseng (Hsinchu County, Taiwan), Victor Chiang Liang (Hsinchu City, Taiwan) and Chwen-Ming Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a molding compound having a first surface and a second surface opposite to the first surface, a passive device component disposed in the molding compound, a via penetrating the moldi...