US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,824, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device structure and methods of forming the same" was invented by Wei-Yip Loh (Hsinchu, Taiwan), Hong-Mao Lee (Hsinchu, Taiwan), Harry Chien (Hsinchu, Taiwan), Po-Chin Chang (Hsinchu, Taiwan), Sung-Li Wang (Hsinchu, Taiwan), Jhih-Rong Huang (Hsinchu, Taiwan), Tzer-Min Shen (Hsinchu, Taiwan) and Chih-Wei Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure and methods of forming the same are described. In some embodiments, the structure includes an N-type source/drain epitaxial fea...