US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Seal rings in integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,173, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Seal rings in integrated circuit package and method" was invented by Hung-Pin Chang (New Taipei, Taiwan), Cheng-Hsien Hsieh (Kaohsiung, Taiwan), Li-Han Hsu (Hsinchu, Taiwan), Wei-Cheng Wu (Hsinchu, Taiwan) and Der-Chyang Yeh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a package includes an integrated circuit die comprising a first insulating bonding layer and a first semiconductor substrate and an interposer comprising a second insulating bonding layer, a first seal ring, and a second semiconductor substrate. ...