US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,170, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of fabricating the same" was invented by Chen-Chiang Yu (Taoyuan City, Taiwan), Tsung-Fu Tsai (Changhua County, Taiwan) and Szu-Wei Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a circuit substrate, a semiconductor device, a plurality of cooling pins, a cooler lid, an anti-fouling coating and a top lid. The semiconductor device is disposed on and electrically connected to the circuit substrate. The cooling pins are disposed on the semiconductor device. The cooler l...