US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Device crack-stop structure to prevent damage due to dicing crack" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,175, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Device crack-stop structure to prevent damage due to dicing crack" was invented by Tung-Ting Wu (Taipei City, Taiwan), Chen-Jong Wang (Hsin-Chu, Taiwan), Jen-Cheng Liu (Hsin-Chu City, Taiwan), Yimin Huang (Hsinchu City, Taiwan) and Chin-Chia Kuo (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an integrated chip including a plurality of semiconductor devices arranged on a substrate and within a device region. A first isolation structure is arranged in the device ...