US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Via array in a redistribution layer structure for stress relief" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,947, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Via array in a redistribution layer structure for stress relief" was invented by Yu-Chung Lai (Taichung City, Taiwan), Ying-Yao Lai (Taichung City, Taiwan), Chen-Chiu Huang (Taichung City, Taiwan), Hsiang-Ku Shen (Hsinchu City, Taiwan), Dian-Hau Chen (Hsinchu, Taiwan), Kuo-An Liu (Hsinchu City, Taiwan) and Tzu-Ting Liu (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect of the present disclosure pertains to an integrated (IC) structure. The IC structure includes a semiconductor substrate; an interconnect structure f...