US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Semiconductor package and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,965, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package and method for forming the same" was invented by Chuei-Tang Wang (Taichung City, Taiwan), Tso-Jung Chang (Taoyuan City, Taiwan), Jeng-Shien Hsieh (Kaohsiung, Taiwan), Chih-Peng Lin (Hsinchu County, Taiwan), Chieh-Yen Chen (Taipei City, Taiwan) and Chen-Hua Yu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor package is provided. The method includes forming a first photonic routing structure over a substrate, disposing the first photonic routing structure over a redis...