US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Semiconductor device and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,949, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and method for manufacturing the same" was invented by Hung-Wei Tsai (Hsinchu, Taiwan), Chih-Wei Wu (Hsinchu, Taiwan) and Ying-Ching Shih (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a first semiconductor module, a reorientation layer, a second semiconductor module and a plurality of jointing materials. The first semiconductor module has at least one first conductive structure and at least one s...