US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 18 for "Photonic semiconductor device, photonic semiconductor package using the same and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,710,588, issued on Aug. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Photonic semiconductor device, photonic semiconductor package using the same and manufacturing method thereof" was invented by Chih-Hao Yu (Hsinchu, Taiwan), Jui Lin Chao (Hsinchu, Taiwan), Hsing-Kuo Hsia (Hsinchu, Taiwan), Shih-Peng Tai (Hsinchu, Taiwan) and Kuo-Chung Yee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photonic semiconductor device including a light-emitting component and a photonic integrated circuit is provided. The light-emitting component at least includes a gain medium layer, a first contact layer and a fir...