US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Heterogeneous packaging integration of photonic and electronic elements" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,710,606, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Heterogeneous packaging integration of photonic and electronic elements" was invented by Stefan Rusu (Hsin-Chu, Taiwan), Weiwei Song (Sunnyvale, Calif.) and Mohammed Rabiul Islam (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Heterogeneous packaging integration of photonic and electronic elements is described herein. In one embodiment, a disclosed package includes: a package substrate; a first layer comprising an electronic die on the package substrate; and a second layer comprising a photonic die. The second layer is bonded ont...