US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 18 for "Bonding scheme for semiconductor packaging" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,957, issued on Aug. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonding scheme for semiconductor packaging" was invented by Wei-Yu Chen (Taipei City, Taiwan), Chao-Wei Chiu (Hsinchu, Taiwan), Hsin Liang Chen (New Taipei City, Taiwan), Hao-Jan Shih (Hsinchu, Taiwan), Hao-Jan Pei (Hsinchu, Taiwan) and Hsiu-Jen Lin (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a method includes forming a device region along a first substrate; forming an interconnect structure over the device region and the first substrate; forming a metal pillar over the interconnect structure, forming the ...