US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,715, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and method for manufacturing the same" was invented by Jhon-Jhy Liaw (Zhudong Township, Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor structure includes defining active areas extending in an X-direction, arranged in a Y-direction, and on a substrate. Each of the active areas has nanostructures. The method further includes forming dummy gate structures across the active areas in the Y-direction, forming merged source/drain features in the active areas and on ...