US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor package, optical device and method of fabricating the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,704,676, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package, optical device and method of fabricating the same" was invented by Chih-Tsung Shih (Hsinchu City, Taiwan), Felix Yingkit Tsui (Cupertino, Calif.), Stefan Rusu (Sunnyvale, Calif.) and Chewn-Pu Jou (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical device includes an input array, an output array and a waveguide array. The input array is connected to a first slab structure, while the output array is connected to a second slab structure. The waveguide array is optically coupled to the first slab structure...