US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Semiconductor device and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,995, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and method of forming same" was invented by Chih-Hsiang Tseng (Hsinchu, Taiwan), Yu-Feng Chen (Hsinchu, Taiwan), Cheng Jen Lin (Kaohsiung, Taiwan), Wen-Hsiung Lu (Tainan, Taiwan), Ming-Da Cheng (Jhubei, Taiwan), Kuo-Ching Hsu (Chung-Ho, Taiwan), Hong-Seng Shue (Zhubei, Taiwan), Ming-Hong Cha (Hsinchu, Taiwan), Chao-Yi Wang (Tainan, Taiwan) and Mirng-Ji Lii (Sinpu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first die having a first substrate, an interconnect structure o...