US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Wafer wet cleaning system" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,747, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Wafer wet cleaning system" was invented by Chih-Wei Chao (Hsinchu, Taiwan) and Shu-Yen Wang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a wafer cleaning process in which a drained cleaning solution, which is used to remove metal contaminants from the wafer, is sampled and analyzed to determine the concentration of metal ions in the solution. The wafer cleaning process includes dispensing, in a wafer cleaning station, a chemical solution on one or more wafers; collecting the dispensed chemical s...