US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Semiconductor structure and manufacturing method thereof" (Belgian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,741, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Oreste Madia (Brussels) and Gerben Doornbos (Kessel-Lo, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a device, a conductor, a backside interconnect, and a thermoelectric generator. The substrate has a front surface and a rear surface opposite to the front surface. The device is disposed on the front surface of the substrate. The conductor is disposed at or near the front surface of the substrate and electrically cou...