US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Semiconductor device and method for thermal dissipation" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,586, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and method for thermal dissipation" was invented by Che Chi Shih (Taoyuan, Taiwan), Jhih-Rong Huang (Hsinchu County, Taiwan), Han-Yu Lin (Nantou County, Taiwan), Ku-Feng Yang (Hsinchu County, Taiwan), Wei-Yen Woon (Taoyuan, Taiwan) and Szuya Liao (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Method to implement heat dissipation multilayer and reduce thermal boundary resistance for high power consumption semiconductor devices is provided. The heat dissipation multilayer comprises a first crystalli...