US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 14 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,521, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Wei-Chih Hou (Hsinchu City, Taiwan), Chun-Jun Lin (Hsinchu City, Taiwan), Feng-Ming Chang (Taitung City, Taiwan) and Shu-Ning Hsu (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes depositing an epitaxial stack over a substrate, the epitaxial stack comprising alternating first semiconductor layers and second semiconductor layers, wherein the first semiconductor layers comprise a different semiconductor composition from that of the seco...