US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, TSMC NANJING on Dec. 2 for "Method of bubble removal from viscous fluid" (Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,367, issued on Dec. 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD (Hsinchu, Taiwan) and TSMC NANJING COMPANY Ltd. (Nanjing, China).

"Method of bubble removal from viscous fluid" was invented by Chian-Niang Lin (Nanjing, China), Barry Tsao (Jhubei, Taiwan) and Tsung Tso Tsai (Nanjing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes receiving, in a first vessel, a flow of fluid from a second vessel, wherein the flow of fluid is generated by pressurizing a head space over the fluid in the second vessel; capturing the flow of fluid from the second vessel at an upper end of a de-bubbling slide in the first vessel...