US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, TSMC CHINA on Sept. 22 for "System and method for semiconductor fabricating process" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,743,069, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and TSMC CHINA COMPANY Ltd. (Shanghai).

"System and method for semiconductor fabricating process" was invented by Lei Xu (Shanghai City, China), Yukai Hou (Shanghai City, China), Fangbo Guo (Shanghai City, China), Bin Yuan (Shanghai City, China), Jing Wang (Shanghai City, China) and Bo Li (Shanghai City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes using a first pump apparatus to control a pressure condition of a first chamber, wherein the first pump apparatus produces a first operation data in a first digital protoco...