US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, TSMC CHINA on April 7 for "Reticle inspection and purging method and tool" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,596,301, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and TSMC CHINA COMPANY Ltd. (Shanghai).

"Reticle inspection and purging method and tool" was invented by Xianhui Zhou (Shanghai City, China), Lei Wang (Shanghai City, China), Zihao Zhang (Shanghai City, China) and Huiming Xu (Shanghai City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A reticle inspection and purging method comprises following steps. A first reticle is moved from a first load port of a lithography tool to a reticle inspection tool located outside the lithography tool. The first reticle is inspected using the reticle insp...