US Patent Issued to Taiwan Semiconductor Manufacturing, National Yang Ming Chiao Tung University on May 13 for "Connector and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,645, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) and National Yang Ming Chiao Tung University (Hsinchu, Taiwan).

"Connector and method for forming the same" was invented by Chih Chen (Hsinchu, Taiwan) and Hsiang-Hou Tseng (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first connector and a second connector over a first wafer and a second wafer, respectively, in which each of the first and second connectors are formed by forming an opening in a dielectric layer; depositing a first metal layer in the opening, in which the first metal layer has a nano-tw...