US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL TAIWAN UNIVERSITY on July 28 for "Semiconductor device with reverse-tapered structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,468, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL TAIWAN UNIVERSITY (Taipei, Taiwan).

"Semiconductor device with reverse-tapered structure and manufacturing method thereof" was invented by Chien-Te Tu (Hsinchu, Taiwan) and Chee-Wee Liu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a semiconductor structure on a substrate; performing a first etching process on the semiconductor structure to form a fin structure upwardly extending above the substrate; performing a second etching process to trim the fin structure to have a reverse-trapezoidal...