US Patent Issued to Taiwan Semiconductor Manufactuing on May 19 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,232, issued on May 19, was assigned to Taiwan Semiconductor Manufactuing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Chun-Sheng Liang (Changhua County, Taiwan), Yu-San Chien (Hsinchu, Taiwan), Pin Chun Shen (Changhua County, Taiwan), Wen-Chiang Hong (Taipei, Taiwan) and Chun-Wing Yeung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first semiconductor structure, a second semiconductor structure, a first isolation block and a second isolation block. The first semiconductor structure includes a first gate structure wrapping around a first sheet st...