ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,152, issued on Feb. 3, was assigned to TAIWAN SEMCONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"EUV lithography system with 3D sensing and tunning modules" was invented by Tai-Yu Chen (Hsinchu, Taiwan), Tzu-Jung Pan (New Taipei, Taiwan), Kuan-Hung Chen (Taoyuan, Taiwan), Sheng-Kang Yu (Hsinchu, Taiwan), Shang-Chieh Chien (New Taipei, Taiwan), Li-Jui Chen (Hsinchu, Taiwan) and Heng-Hsin Liu (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control...