US Patent Issued to TAIWAN MICROLOOPS on Jan. 27 for "Heat dissipation device of heat pipe combined with vapor chamber" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,278, issued on Jan. 27, was assigned to TAIWAN MICROLOOPS CORP. (New Taipei, Taiwan).

"Heat dissipation device of heat pipe combined with vapor chamber" was invented by Chun-Hung Lin (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device includes a vapor chamber (1) and at least one heat pipe (2). The vapor chamber (1) includes a bottom plate (10) and a top plate (11) combined with each other to form a cavity (100); the cavity (100) contains a top plate capillary layer (11a) covering the top plate (11) which has at least one through hole (110). The heat pipe (2) includes a pipe body (20) with a closed end (200) ...