US Patent Issued to Taiwan Aerogel Technology Material on Sept. 1 for "Low-dielectric and low-thermalconductivity aerogel composites and preparation method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,142, issued on Sept. 1, was assigned to Taiwan Aerogel Technology Material Co. Ltd. (Tainan City, Taiwan).

"Low-dielectric and low-thermalconductivity aerogel composites and preparation method thereof" was invented by Jean Hong Chen (Tainan City, Taiwan), Shiu Shiu Chen (Tainan City, Taiwan), Cheng Shu Chiang (Tainan City, Taiwan) and Chi Hung Lo (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The aerogel molecules mixed with aqueous solution containing a trace amount of alcohols solvent is dispersed by mixer to form an aerogel suspension dispersion solution containing a trace amount of alcohols, which can be uniformly aerogel/fi...