US Patent Issued to Taichi Metal Material Technology on Oct. 20 for "Process for polishing and grinding copper foil surface for reducing roughness thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,658, issued on Oct. 20, was assigned to Taichi Metal Material Technology Co. Ltd. (Tainan, Taiwan).

"Process for polishing and grinding copper foil surface for reducing roughness thereof" was invented by Kuan-Wei Chen (Tainan, Taiwan), Kuan-Yu Chen (Tainan, Taiwan) and Jason Shian-Ching Jang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A process for polishing and grinding a copper foil surface comprises implementing a main roller made of soft, porous, fibrous and compressible materials, and placing a plurality of metallic-glass particles injected, impinged or applied to the peripheral surface of the main roller, whereby upon rotati...