US Patent Issued to Synopsys on March 17 for "Power routing for 2.5D or 3D integrated circuits including a buried power rail and interposer with power delivery network" (California Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,933, issued on March 17, was assigned to Synopsys Inc. (Sunnyvale, Calif.).

"Power routing for 2.5D or 3D integrated circuits including a buried power rail and interposer with power delivery network" was invented by Xi-Wei Lin (Fremont, Calif.) and Victor Moroz (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments relate to an electronic circuit implemented using a first integrated circuit die, a second integrated circuit die, and an interposer connecting the first integrated circuit die to the second integrated circuit die. The first integrated circuit die implements a first electronic circuit. The first integrated circuit d...