US Patent Issued to SWCC on May 20 for "Method of manufacturing sheet material made of copper-silver alloy and method of manufaturing sheet for electrode of probe card" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,269, issued on May 20, was assigned to SWCC Corp. (Kanagawa, Japan).

"Method of manufacturing sheet material made of copper-silver alloy and method of manufaturing sheet for electrode of probe card" was invented by Tsutomu Koizumi (Kanagawa, Japan), Go Odachi (Kanagawa, Japan) and Ryuichi Arai (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing sheet material made of copper-silver alloy, the method comprising the steps of: (a) casting continuously copper-silver alloy so as to obtain base material having a thickness or diameter within a range of 6 to 30 mm; (b) rolling the base material at least once so as to obt...