US Patent Issued to SVG TECH GROUP on Dec. 23 for "3D integrated imaging devices and preparation methods thereof" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,644, issued on Dec. 23, was assigned to SVG TECH GROUP Co. LTD. (Suzhou, China).

"3D integrated imaging devices and preparation methods thereof" was invented by Ming Zhu (Suzhou, China), Ying Yang (Suzhou, China), Guoyong Zhang (Suzhou, China), Shunda Xu (Suzhou, China), Renjin Shao (Suzhou, China), Donglin Pu (Suzhou, China) and Xiaoning Liu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a 3D integrated imaging device and a preparation method thereof. The 3D integrated imaging device includes a spacer layer, a three-dimensional structure layer, and a microlens array. The spacer layer has a preset thi...