US Patent Issued to Super Micro Computer on Nov. 3 for "Heat sink assembly for dual in-line memory modules" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,027, issued on Nov. 3, was assigned to Super Micro Computer Inc. (San Jose, Calif.).

"Heat sink assembly for dual in-line memory modules" was invented by Chun Hao Chen (San Jose, Calif.) and Ruei-Fu Weng (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a heat sink assembly for dual in-line memory modules (DIMMs). The heat sink assembly includes side plates and a heat sink of an electronic device. The side plates clamp the DIMMs. Heat from the DIMMs is conducted to the heat sink of the electronic device, which is cooled by a liquid coolant."

The patent was filed on July 16, 2024, under Application No. 18/774,120.

*For fu...