ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,617, issued on April 14, was assigned to Sumitomo Wiring Systems Ltd. (Yokkaichi, Japan).
"Composite molded component" was invented by Hironobu Yamamoto (Yokkaichi, Japan), Yukitoshi Terasaka (Yokkaichi, Japan), Kyungwoo Kim (Yokkaichi, Japan) and Toshinari Kobayashi (Yokkaichi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The object of the present invention is to further improve the performance of a seal between an inner molded portion and an outer molded portion. A composite molded component includes: an internal component; an inner molded portion that covers the internal component; and an outer molded portion that covers the inner molded...