ALEXANDRIA, Va., April 7 -- United States Patent no. 12,597,589, issued on April 7, was assigned to Sumitomo Osaka Cement Co. Ltd. (Tokyo).
"Electrostatic chuck" was invented by Masaki Hirayama (Tokyo) and Tetsuro Itagaki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an electrostatic chuck device including: an electrostatic chuck plate which has a dielectric substrate having a placement surface on which a wafer is placed and electrodes positioned in the dielectric substrate; a focus ring which is installed on an outer peripheral portion of the electrostatic chuck plate and surrounding the placement surface; and a power connection portion which connects the electrode and a power supply. Th...