ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,572, issued on Oct. 27, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan) and SUMITOMO ELECTRIC PRINTED CIRCUITS INC. (Shiga, Japan).
"Printed wiring board" was invented by Shun Igarashi (Osaka, Japan), Ichiro Kuwayama (Osaka, Japan), Suguru Yamagishi (Osaka, Japan), Hiroshi Ueda (Osaka, Japan) and Satoshi Kiya (Shiga, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern and a first ground pattern disposed on the second main surface and extending...