US Patent Issued to SUMCO on Jan. 20 for "Method of cleaning semiconductor wafer and method of manufacturing semiconductor wafer" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,686, issued on Jan. 20, was assigned to SUMCO Corp. (Tokyo).

"Method of cleaning semiconductor wafer and method of manufacturing semiconductor wafer" was invented by Mami Kubota (Tokyo), Ryosuke Takahashi (Tokyo) and Sayaka Makise (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "This method of cleaning a semiconductor wafer can reliably reduce the LPD count on the wafer surface. The method includes a first step of measuring a contact angle of a surface of a semiconductor wafer under conditions in which a volume of a droplet dripped on the surface differs, a second step of calculating a ratio of change in a measured value of the contact angle to...