ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,874, issued on Feb. 10, was assigned to SUMCO Corp. (Tokyo).
"Apparatus for double-side polishing work" was invented by Yuji Miyazaki (Saga, Japan) and Masaru Morita (Saga, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a double-side polishing apparatus includes at least one work thickness measuring instrument in real time during double-side polishing of the work; an inner circumferential surface defined by the through hole in said one of the upper plate and the lower plate is provided with a metal cylindrical member; and either of: a lower window provided in a lower part of the cylindrical member provided in the upper plate and an upper wi...