US Patent Issued to SUMCO on Dec. 16 for "Method of polishing silicon wafer and method of producing silicon wafer" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,496,678, issued on Dec. 16, was assigned to SUMCO Corp. (Tokyo).

"Method of polishing silicon wafer and method of producing silicon wafer" was invented by Masahiro Murakami (Tokyo) and Ryoya Terakawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of polishing a silicon wafer, including a final polishing step including a pre-stage polishing step and a subsequent finish polishing step. The finish polishing step in the final polishing step includes a finish slurry polishing step using a polishing solution having an abrasive grain density of 1x1013/cm3 or more as the second polishing solution; and a pre-polishing step using a polishing solut...