ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,804, issued on Oct. 6, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Semiconductor device and corresponding method" was invented by Aurora Sanna (Milan), Cristina Somma (Cinisello Balsamo, Italy) and Damian Halicki (Agrate Brianza, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A BGA package includes an array of electrically conductive balls providing electrical contact for a semiconductor die. A power channel is provided to convey power supply current towards the semiconductor die. The power channel is formed by a stack of electrically conductive planes. The electrically conductive planes are stacked in a stepped arrangem...