US Patent Issued to STMICROELECTRONICS on March 31 for "Process for manufacturing a micro-electro-mechanical device from a single semiconductor wafer and related MEMS device" (Italian Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,989, issued on March 31, was assigned to STMICROELECTRONICS S.R.L. (Agrate Brianza, Italy).

"Process for manufacturing a micro-electro-mechanical device from a single semiconductor wafer and related MEMS device" was invented by Gianluca Longoni (Cernusco sul Naviglio, Italy), Luca Seghizzi (Milan) and Andrea Nomellini (Milan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to a process for manufacturing a micro-electro-mechanical system (MEMS) device. The process includes, in part, forming a first sacrificial dielectric region on a semiconductor wafer; forming a structural layer of semiconductor material on the firs...