US Patent Issued to STMICROELECTRONICS on Jan. 20 for "Methods and apparatus for supporting secondary platform bundles" (Italian Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,179, issued on Jan. 20, was assigned to STMICROELECTRONICS S.R.L. (Agrate Brianza, Italy).

"Methods and apparatus for supporting secondary platform bundles" was invented by Sofia Massascusa (Caserta, Italy), Giulio Follero (Pozzuoli, Italy) and Marco Alfarano (Naples, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes compiling, by a compiler of a Smart Secure Platform (SSP) supporting a Primary Platform and a Secondary Platform, source code comprising an implementation of an operating system of the Secondary Platform and applications of the Secondary Platform, to produce compiled source code compatible by an operating system of ...