US Patent Issued to STMicroelectronics on Jan. 13 for "Method of coupling semiconductor dice and corresponding semiconductor device" (Italian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,512, issued on Jan. 13, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Method of coupling semiconductor dice and corresponding semiconductor device" was invented by Andrea Albertinetti (Sizzano, Italy) and Mirko Alesi (Gorgonzola, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulation of laser direct structuring (LDS) material is molded onto a substrate having first and second semiconductor dice arranged thereon. Laser beam energy is applied to a surface of the encapsulation of LDS material to structure therein die vias extending through the LDS material to the first and second semiconductor dice and a die-to-die ...