US Patent Issued to STMICROELECTRONICS on Feb. 17 for "Semiconductor package or device with barrier layer" (Italian Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,686, issued on Feb. 17, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy).

"Semiconductor package or device with barrier layer" was invented by Lucrezia Guarino (Milan), Francesca Milanesi (Milan) and Claudio Zafferoni (Vimercate, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to embodiments of a conductive structure on a conductive barrier layer that separates the conductive structure from a conductive layer on which the conductive barrier layer is present. A gap or crevice extends along respective surfaces of the conductive structure and along respective surfaces of one or more insulating la...