US Patent Issued to STMICROELECTRONICS INTERNATIONAL on Nov. 3 for "Module packaging architecture to reduce crosstalk in an optical sensor" (British Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,192, issued on Nov. 3, was assigned to STMICROELECTRONICS INTERNATIONAL N.V. (Geneva).

"Module packaging architecture to reduce crosstalk in an optical sensor" was invented by Calum Ritchie (Glasgow, Great Britain), Colin Campbell (Darvel, Great Britain) and Matteo Fissore (Edinburgh, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments are directed to an optical sensor configured to transmit and receive optical radiation while minimizing optical noise, such as crosstalk. An example optical sensor includes an optical radiation source configured to direct optical radiation at a target object, an optical radiation receiver c...