US Patent Issued to STMicroelectronics International on March 31 for "Die stacking with controlled tilt and angular alignment" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,990, issued on March 31, was assigned to STMicroelectronics International N.V. (Geneva).

"Die stacking with controlled tilt and angular alignment" was invented by Chayathorn Saklang (Mesa, Ariz.), Stephen Ryan Hooper (Queen Creek, Ariz.), Dwight Lee Daniels (Phoenix), Scott M Hayes (Chandler, Ariz.) and Jin Yang (North Plains, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Alignment features formed on a cover substrate allow for a second substrate to be bonded to the cover substrate while ensuring that the second substrate is not titled with respect to a plane defined by the alignment features. Die attachment material is patterned such that it...