US Patent Issued to STMicroelectronics International on June 23 for "Decoupling method for semiconductor device" (Maltese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,371, issued on June 23, was assigned to STMicroelectronics International N.V. (Geneva).

"Decoupling method for semiconductor device" was invented by Roseanne Duca (Ghaxaq, Malta).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package includes a packaging formed by a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom, the sidewalls and package bottom defining a cavity. An integrated circuit is attached to the package bottom. A plate extends between two of the sidewa...