US Patent Issued to STMicroelectronics International on July 15 for "Leadframe with a metal oxide coating and method of forming the same" (Singaporean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,195, issued on July 15, was assigned to STMicroelectronics International N.V. (Geneva).

"Leadframe with a metal oxide coating and method of forming the same" was invented by Luca Maria Carlo Di Dio (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A leadframe including a metal oxide layer on at least a portion of the leadframe are disclosed. More specifically, leadframes with a metal layer and a metal oxide layer formed on one or more leads before a tin finish plating layer is formed are described. The layers of metal and metal oxide between the one or more leads and the tin finish plating layer reduce the formation of tin whiskers, thus red...