US Patent Issued to STMicroelectronics France on Jan. 27 for "Method for producing an electronic component assembly on the front face of a semi-conductor wafer" (French Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,807, issued on Jan. 27, was assigned to STMicroelectronics France (Montrouge, France).

"Method for producing an electronic component assembly on the front face of a semi-conductor wafer" was invented by Matthieu Nongaillard (Grenoble, France) and Thomas Oheix (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention concerns a method of manufacturing an assembly of electronic components (3) on the front surface of a semiconductor wafer (1) comprising a plurality of field areas (4), each area (4) comprising at least one field (2) and each field (2) comprising at least one electronic component (3). The method comprises a plurality...