US Patent Issued to STMicroelectronics (Grenobles 2) on Feb. 17 for "Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting process" (French Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,424, issued on Feb. 17, was assigned to STMicroelectronics (Grenobles 2) SAS (Grenoble, France).

"Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting process" was invented by Karine Saxod (Les Marches, France) and Nicolas Mastromauro (Lumbin, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the ...